发明名称 POLISHING PAD
摘要 <p>A polishing pad is provided to obtain a uniform polished surface of an object by restricting the abrasion in polishing. A polishing pad(1) comprises a polyurethane sheet(2) having a volume density of 0.2~0.4g/cm and a thickness of 0.7~2.0mm, and a double-sided adhesive tape(8). The polyurethane sheet includes foam(3) about half the thickness and foam(4) more than 70% of the thickness which are opened by buffing, and apertures(5,6) on a polishing surface(P). The ratio of apertures of 30~50mum is over 50%, and the number of the apertures per 1mm^2 of the polishing surface is 50~100.</p>
申请公布号 KR20090034712(A) 申请公布日期 2009.04.08
申请号 KR20080057513 申请日期 2008.06.18
申请人 FUJIBO HOLDINGS, INC. 发明人 TADASHI IWASE;TOMOHIRO IWAO
分类号 B24D11/00;B24B37/26 主分类号 B24D11/00
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