| 摘要 |
<p>A method for separating a protective tape and an apparatus using the same are provided to separate a separation tape and the protective tape from a surface of a semiconductor wafer by adhering a non-adhesive surface of the separation tape to the surface of the protective tape. A cassette is mounted in a wafer supply unit(2). A wafer transfer device(3) includes a robot arm(4) and a compressor(5). An alignment stage(7) arranges the position of the wafer. A ultraviolet irradiation unit(14) irradiates the ultraviolet ray to the loaded wafer. A chuck table(15) absorbs the wafer. A ring frame is received in a ring frame supply unit(16) in a multi-stage. A ring frame transferring device(17) moves the ring frame to the adhesive tape. A tape processing unit(18) adheres the adhesive tape to the rear side of the ring frame. A ring frame lifting device(26) lifts the ring frame. A mount frame manufacturing unit(27) makes an integrated mount frame by adhering the wafer to the ring frame. A first mount frame transferring device(29) transfers the mount frame. A separation device(30) is adhered in the surface of the wafer. A second mount frame transferring device(35) transfers the mount frame by the separation device. A turn-table(36) converts the direction of the mount frame. A mount frame recovery unit(37) receives the mount frame in the multi-stage.</p> |
