发明名称 |
THIN-FILM SEMICONDUCTOR COMPONENT AND COMPONENT ASSEMBLY |
摘要 |
The invention describes a thin-film semiconductor component having a carrier layer and a layer stack which is arranged on the carrier layer, includes a semiconductor material and is intended to emit radiation, wherein a heat-dissipating layer which is intended to cool the semiconductor component is applied to the carrier layer. The invention also describes a component assembly. |
申请公布号 |
KR20090035040(A) |
申请公布日期 |
2009.04.08 |
申请号 |
KR20097004412 |
申请日期 |
2007.07.16 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
HERRMANN SIEGFRIED;HAHN BERTHOLD |
分类号 |
H01L33/00;H01L33/38;H01L33/54;H01L33/62;H01L33/64 |
主分类号 |
H01L33/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|