发明名称 |
ADHESIVE FOR ELECTRONIC COMPONENTS, METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP LAMINATE, AND SEMICONDUCTOR DEVICE |
摘要 |
It is an object of the present invention to provide: an adhesive for electronic parts that makes it possible to accurately maintain a distance between electronic parts upon joining electronic parts such as two or more semiconductor chips and also to obtain reliable electronic parts such as a semiconductor device; a method for producing a semiconductor chip laminated body using the adhesive for electronic parts; and a semiconductor device using the adhesive for electronic parts. The present invention is an adhesive for electronic parts configured to join the electronic parts, which contains: an adhesive composition comprising a curing compound and a curing agent; and spacer particles having a CV value of 10% or less, a viscosity at 1 rpm being 200 Pa·s or less and a viscosity at 10 rpm being 100 Pa·s or less, upon being measured at 25°C by using an E type viscometer, and a viscosity at 0.5 rpm being 1.4 to 3 times as large as the viscosity at 1 rpm, and the viscosity at 1 rpm being 2 to 5 times as large as the viscosity at 10 rpm. |
申请公布号 |
EP2045839(A1) |
申请公布日期 |
2009.04.08 |
申请号 |
EP20070791028 |
申请日期 |
2007.07.19 |
申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
ISHIZAWA, HIDEAKI;HAYAKAWA, AKINOBU |
分类号 |
H01L21/52;C09J11/04;C09J163/00;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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