| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To firmly join a molding of a metal alloy and a thermosetting resin composition, without interposing an adhesive. <P>SOLUTION: The metal alloy 1 is surface-treated (1) to generate a roughness of micron order having 0.8-10μm of RSm and 0.2-5μm of Rz, (2) to form superfine irregularity with 5-500 nm of cycle, in an plane having the roughness, and (3) to form a surface layer into a thin layer of a metal oxide or a metal phosphate. The metal alloy is inserted thereafter into an injection molding die. A wet type BMC (bulk molding compound) is injected on a surface of the inserted metal alloy, a molding 4 of the metal alloy and the wet type BMC is joined without interposing the adhesive, by curing the injected BMC after intruded into the superfine irregularity. The composite 7 obtained by this manner has 20-30 MPa of shearing breaking force, and allows firm junction. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
