EPOXY RESIN COMPOSITION, B-STAGE FILM, LAMINATED FILM, COPPER CLAD LAMINATE, AND MULTILAYER SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition capable of preventing the generation of cracks to a laminate when exposed to severe conditions after laminating to members such as copper foil and curing.

SOLUTION: The epoxy resin composition comprises an epoxy resin, an active ester compound as a curing agent, an imidazole compound having a silane skeleton as a curing accelerator, and a filler, in which the content of the active ester compound is within a range of 50 to 200 pts.wt. and the content of the imidazole compound having the silane skeleton is within a range of 0.5 to 7 pts.wt., based on 100 pts.wt. of the epoxy resin.

COPYRIGHT: (C)2011,JPO&INPIT