发明名称 METHOD OF MANUFACTURING WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board with high electric connection reliability capable of normally making the electrical connection of winding conductors through a through-conductor and capable of normally operating loaded electronic parts. <P>SOLUTION: A method of manufacturing the winding board comprises steps of: sticking a resin film 2 with an adhesive 3 on a principal plane of an insulating sheet 1 used as an insulating layer 21 of the winding board through the adhesive 3 in a state that any tension is not applied to the resin film 2; forming a through hole 5 at the insulating sheet 1 to which the resin film 2 is stuck through the adhesive 3 so as to pierce the insulating sheet 1 together with the resin film 2 and the adhesive 3; filling conductive paste 6 in the through hole 5; exfoliating and removing the resin film 2 together with the adhesive 3 from the principal plane of the insulating sheet 1 with which the conductive paste 6 is filled in the through hole 5; and transcribing a wiring conductor 8 composed of copper foil connected with the conductive paste 6 on the principal plane of the insulating sheet 1 from which the resin film 2 is exfoliated. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2010278361(A) 申请公布日期 2010.12.09
申请号 JP20090131453 申请日期 2009.05.29
申请人 KYOCER SLC TECHNOLOGIES CORP 发明人 KONO TOSHIYA
分类号 H05K3/40 主分类号 H05K3/40
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