RESIN COMPOSITION, PROCESS FOR PRODUCING RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE AND PRINTED-WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a resin composition which has a low viscosity while maintaining excellent dielectric properties possessed by PPE and excels in the heat resistance of a cured product and the adhesion to a copper foil and the like. SOLUTION: The resin composition includes a reaction product between a low-molecular weight polyphenylene ether having a number average molecular weight of 800-2,000 and averaging 1.5-2 hydroxyl groups per molecule and a low epoxy group number epoxy resin having averaging 2.3 or less epoxy groups per molecule, and a thermosetting resin. COPYRIGHT: (C)2011,JPO&INPIT