| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device allowing a high-reliability test while keeping performance of a multichip module, and to provide a module. SOLUTION: This semiconductor device includes: a plurality of first external terminals; a plurality of second external terminals; a plurality of third external terminals; a plurality of fourth external terminals; a fifth external terminal; a sixth external terminal; a seventh external terminal; an eighth external terminal; a first semiconductor chip connected to the plurality of first external terminals, the plurality of second external terminals, the third external terminals, the plurality of fourth external terminals, the fifth external terminal, and the seventh external terminal; a second semiconductor chip connected to the plurality of second external terminals, the plurality of third external terminals and the sixth external terminal; and a third semiconductor chip connected to the plurality of second external terminals, the plurality of fourth external terminals and the eighth external terminal. COPYRIGHT: (C)2011,JPO&INPIT |
