| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method for manufacturing the same that prevent a short circuit between electrodes without adding an extra step causing a cost increase while coping with narrow pitching. SOLUTION: The semiconductor device (3) includes an electrode pad (1) and each bump (2) provided on the electrode pad (1). A semiconductor carrier substrate (4) includes a substrate electrode (9). A space (S) is formed at each bump (2). Each bump (2) is physically and electrically connected to the substrate electrode (9) by solder (6) while the solder (6) not used for connection is received in the space (S). COPYRIGHT: (C)2011,JPO&INPIT
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