HEAT DISSIPATING SYSTEM AND CONNECTOR THEREOF

摘要

A heat dissipating system includes a chassis, a motherboard mounted in the chassis, a number of connectors mounted on the motherboard in parallel to form a passage between every two adjacent connectors, and a heat dissipating element mounted to the chassis and aligned with the passages. Each of the connectors includes a socket and an inserting portion. The socket defines a slot. The inserting portion includes a main body and a protrusion extending from the main body towards the slot. A cross-section of the protrusion is trapezoidal-shaped. A side surface of the protrusion is inclined to form an airflow guiding structure.