| 摘要 |
A semiconductor device includes a substrate; first and second semiconductor pillars; a first insulator; and a first wiring layer. The first and second semiconductor pillars are disposed over the substrate. The first and second semiconductor pillars may be aligned in a first direction. The first insulator may eclectically isolate the first and second semiconductor pillars from each other. The first wiring layer may continuously extend inside a first continuing groove that extends through the first and second semiconductor pillars and the first insulator. The first continuing groove extends in a first direction along which the first and second semiconductor pillars are aligned.
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