LED PACKAGE MODULE AND METHOD FOR FABRICATING SAME

摘要

The present invention relates to an LED package module and to a method for fabricating same. An LED package module according to the present invention comprises: a printed circuit board defining a plurality of insert holes and having a circuit pattern including an electrode pattern formed thereon; a plurality of heat sink fins fixed through the insertion or press-fitting thereof in the plurality of insert holes, respectively; a plurality of LED chips mounted on certain portions of the printed circuit board, respectively, including upper portions of the plurality of heat sink fins; and a reflector stacked on and coupled to an upper portion of the printed circuit board and defining at least one reflecting hole therein, such that one heat sink fin and one LED chip are positioned to correspond to one reflecting hole, or a plurality of heat sink fins and the plurality of the LED chips are positioned to correspond to one reflecting hole, on a portion of the printed circuit board exposed by the at least one reflecting hole, and the at least one reflecting hole has a reflective surface formed on an inner periphery thereof. According to the present invention, heat-dissipating efficiency and light-emitting efficiency can be increased.