发明名称 |
METAL-CLAD LAMINATE AND METHOD FOR PRODUCING METAL-CLAD LAMINATE |
摘要 |
<p>Disclosed is a metal-clad laminate wherein adhesion between a metal layer and a thermoplastic film serving as a base is improved, the deposition rate of a coating film on the base is improved, and the insulation resistance after etching is properly adjusted at the same time. Also disclosed is a method for producing a metal-clad laminate. The metal-clad laminate comprises a base that is composed of a thermoplastic polymer film, a base metal layer that is provided on the surface of the base, and an upper metal layer that is provided on the surface of the base metal layer. The base metal layer is formed from a copper alloy that contains 0.05-0.21% by mass of phosphorus, and the upper metal layer is formed from copper or a copper alloy.</p> |
申请公布号 |
WO2010140638(A1) |
申请公布日期 |
2010.12.09 |
申请号 |
WO2010JP59389 |
申请日期 |
2010.06.02 |
申请人 |
FURUKAWA ELECTRIC CO., LTD.;FUJISAWA, KIMIKO;OHGA, KENICHI |
发明人 |
FUJISAWA, KIMIKO;OHGA, KENICHI |
分类号 |
B32B15/08;C23C18/40;H05K1/09 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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