SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

Disclosed is a semiconductor substrate having a semiconductor device formable region, wherein a reinforcing section which is thicker than the semiconductor device formable region and has a top portion having a flat surface is formed on the outer circumferential portion of the semiconductor substrate, and the inner side surface, which connects the top portion of the reinforcing section and the semiconductor device formable region has a cross-section shape wherein the inner diameter is reduced toward the semiconductor device formable region.