FORMING THE SEMICONDUCTOR DEVICE PACKAGE

摘要

PURPOSE: A method for forming a semiconductor device package is provided to form a package structure with high reliability by controlling the shape of a via hole. CONSTITUTION: The lower side of a molding cap(120) is formed with a recess structure(123) corresponding to a first package. A first package is formed by providing a first chip to a first substrate. The first substrate is electrically connected to the first chip with a bonding bump or bonding wire. A first pad is formed on the upper side of the first substrate for electrical connection.