| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device by which a resin package can be suppressed from being upsized even when a plurality of electronic components are arranged in the one resin package, and to provide the electronic device. <P>SOLUTION: The method of manufacturing the electronic device includes processes of: preparing a first lead frame having a first lead having a first portion positioned in a first region; electrically connecting the first lead and a first electronic component to each other; bending the first lead so that the first portion is positioned outside the first region; superposing a second lead frame on the first lead frame so that a second portion of a second lead that the second lead frame has is positioned in the first region; and electrically connecting the second lead and a second electronic component to each other. <P>COPYRIGHT: (C)2011,JPO&INPIT |
