| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To contribute to stable thermal coupling by securing excellent thermal conductivity of TIM interposed between an electronic component and a heat dissipating component and absorbing shape change of the electronic component by heat during the operation. <P>SOLUTION: A method of manufacturing an electronic component device includes: providing a recessed part 22 at the predetermined place of the heat dissipating component 20 and storing a thermoplastic resin 24 as the thermal interface material (TIM) in the recessed part 22; and preparing an array of many raised linear thermally conductive elements 14 as the TIM on the surface of the heat dissipating component 20 on the side where the recessed part 22 is formed (or on the exposed-side surface of the electronic component 10). Next, on the substrate 12, the heat dissipating component 20 is arranged with the surface on the side where the recessed part 22 is formed inside, and the heat dissipating component 20 is fixed on the substrate 12 in a state that the clearance between the electronic component 10 and heat dissipating component 20 is adjusted. Then the resin 24 is heated at its softening temperature to be fluid and is made to flow in the gap between the electronic component 10 and heat dissipating component 20 to fill it. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
