发明名称 METHOD OF FORMING CONDUCTOR PATTERN AND ELECTRONIC CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of forming a conductor pattern that improves insulation reliability between conductor patterns by preventing residues from remaining between the conductor patterns, and prevents a surface of an insulating substrate from decreasing in reflection factor. SOLUTION: The conductor pattern 3 is formed through the steps of: forming a conductor film 2 on the surface of the insulating substrate 1; performing etching processing on the conductor film 2 to remove part of the conductor pattern 2 in a prescribed pattern; and carrying out sand blast processing to remove residues 2a of the conductor film 2 remaining on the surface of the insulating substrate 1 at the part where the conductor film 2 is removed. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010278410(A) 申请公布日期 2010.12.09
申请号 JP20090204448 申请日期 2009.09.04
申请人 MITSUBOSHI BELTING LTD 发明人 KOBAYASHI KOJI;KURODA KOTARO;HAYASHI TERUHIRO
分类号 H05K3/04;H05K3/06 主分类号 H05K3/04
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