摘要 |
PROBLEM TO BE SOLVED: To provide a mold resin molding which can narrow the separation interval of plate metallic conductors, secure the uniformity of the separation interval of the plate metallic conductors, and prevent the occurrence of peeling in the adhesion interface between the plate metallic conductor and a resin for molds. SOLUTION: A plurality of the plate metallic conductors 2 and 3 are laminated at constant intervals of 500μm or below. By molding, the circumference of each plate metallic conductor 2 or 3 is coated with an insulating adhesive resin composition 4 having a melt viscosity of 50 Pa s or below, and the separation interval is filled with the resin composition 4, so that the plate metallic conductors 2 and 3 are separated electrically from each other, and the whole is laminated/unified to obtain the mold resin molding. COPYRIGHT: (C)2011,JPO&INPIT
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