| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for capturing and fixing scattered molten solder droplets when soldering a heat sink onto a semiconductor chip which is flip-chip mounted on a wiring board. SOLUTION: A semiconductor device 20 includes a substrate 21, a semiconductor element 22 which is flip-chip mounted on the main surface of the substrate, a passive component 26 which is mounted around the semiconductor element on the main surface of the substrate, and a heat dissipation member 24 which is mounted above the semiconductor element and the passive element on the main surface of the substrate, wherein a resin layer 27 consisting of thermoplastic resin or thermosetting resin containing thermoplastic resin is formed on the exposed part of the main surface 21a of the substrate. COPYRIGHT: (C)2011,JPO&INPIT
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