| 摘要 |
A solder handling temperature controller comprises a body (10) of the solder handling temperature controller, a rotating shaft (77) housed in the body (10) and adapted to be rotatable about its axis, a set temperature changing means (75) adapted to change a set temperature according to a rotation angle of the rotating shaft (77), a rotary knob (20) supported by the body (10) in a rotatable manner relative to the rotating shaft (77), and a temperature lock key (40) adapted to be selectively insertable into and withdrawable from the body (10) in a position coaxial with the rotating shaft (77) and the knob (20), and, in an inserted state thereof, to mechanically couple the rotating shaft (77) and the knob (20) together to allow them to be interlockingly rotated, wherein, when the temperature lock key (40) is withdrawn from the body (10), the coupling between the rotating shaft (77) and the knob (20) is released to prohibit the change of the set temperature by the rotation of the knob (20).
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