| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical device improved in an environment resistance characteristic without increasing cost. SOLUTION: This optical device includes: a laser chip 110; a package member 120 for holding the laser chip 110 in a region 121 having a circumference surrounded by a wall; and translucent cover glass 140 joined to the package member 120 with an epoxy resin-based adhesive 160 for sealing the region 121 having the circumference surrounded by the wall. The epoxy resin-based adhesive 160 is applied at a uniform width (a) to surround the region 121 surrounded by the wall, and the value of [application width (a) of the epoxy resin-based adhesive 160 relating the adhesion]/[length (4b) of outer periphery of the epoxy resin-based adhesive 160 relating the adhesion] is≥0.057. COPYRIGHT: (C)2011,JPO&INPIT |
