Pressure sensor device for semiconductor chip arrangement, has sensor chip projecting pressure intake regions in housing chambers, where chambers include through-holes and pressure intake regions are supplied with absolute pressure

摘要

The device has a sensor chip (1) mounted on a carrier (5), and a mounting area (1a) spaced from two pressure intake regions. A housing (M) is designed to surround the sensor chip. The sensor chip projects the pressure intake regions in housing chambers (KA, KB). The housing chambers include through-holes, and the pressure intake regions are supplied with outside absolute pressure. The pressure intake regions include membrane regions (MA, MB) with piezoresistive devices (R11-R14, R21-R24). A molding house includes the carrier of the lead frame and the hosing. An independent claim is also included for a method for manufacturing a pressure sensor device.