| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bonding method which efficiently bonds two substrates strongly at high dimensional precision and under a low temperature and further, is able to electrically connect conductive parts provided in each substrate to each other, and to provide a bonding body for electrically connecting and bonding the two substrates through such a bonding method. <P>SOLUTION: The bonding method includes the steps of preparing a substrate 21 provided with a wiring pattern 212 and a substrate 22 provided with a wiring pattern 222; supplying the substrate 21 with a liquid material 30 containing polyester denatured silicone materials and conductive particles 32 to form a liquid film 31; superimposing the substrate 21 on the substrate 22 via the liquid film 31 to form a temporarily bonding body 5 and pressurizing it in the thickness direction; drying and/or hardening the liquid film 31 to obtain a bonding film 3; and imparting energy to the bonding film 3 to make adhesive properties reveal in the bonding film 3, bonding the substrate 21 to the substrate 22 to obtain a bonding body 1 and energizing between the respective wiring patterns 212 and 222. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
