发明名称 FLEXIBLE WIRING BOARD, ASSEMBLING STRUCTURE OF THE SAME, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a flexible wiring board in which noise is hardly superimposed on a signal passing through wiring even if the board is used while being folded, to provide an assembling structure of the flexible wiring board, and to provide an electronic apparatus. SOLUTION: A flexible wiring board 15 includes: a base material 31 (a base film); a signal line 32 and a ground layer 33 formed on both faces of the base material 31; and a protective film 38 covering the signal line 32 and the ground layer 33. The signal line 32 and the ground layer 33 are formed on each of routes that are alternately changed between a surface side and a rear surface side of the base material 31 via through holes 34-37, and are mutually formed in faces on opposite sides of the base material 31. The signal line 32 and the ground layer 33 face each other in a portion where faces of the flexible wiring board 15 while being folded face each other. In bent portions R1 and R2, the ground layer 33 is located on the outer peripheral surface side of the base material 31. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010278132(A) 申请公布日期 2010.12.09
申请号 JP20090127758 申请日期 2009.05.27
申请人 SEIKO EPSON CORP 发明人 SAKURADA NORIAKI
分类号 H05K1/02;H05K7/14 主分类号 H05K1/02
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