发明名称 LOW-K INTERLEVEL DIELECTRIC MATERIALS AND METHOD OF FORMING LOW-K INTERLEVEL DIELECTRIC LAYERS AND STRUCTURES
摘要 A composition of matter and a structure fabricated using the composition. The composition comprising: a resin; polymeric nano-particles dispersed in the resin, each of the polymeric nano-particle comprising a multi-arm core polymer and pendent polymers attached to the multi-arm core polymer, the multi-arm core polymer immiscible with the resin and the pendent polymers miscible with the resin; and a solvent, the solvent volatile at a first temperature, the resin cross-linkable at a second temperature, the polymeric nano-particle decomposable at a third temperature, the third temperature higher than the second temperature, the second temperature higher than the first temperature, wherein a thickness of a layer of the composition shrinks by less than about 3.5% between heating the layer from the second temperature to the third temperature.
申请公布号 US2010311895(A1) 申请公布日期 2010.12.09
申请号 US20100857633 申请日期 2010.08.17
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 DUBOIS GERAUD JEAN-MICHEL;HEDRICK JAMES LUPTON;KIM HO-CHEOL;LEE VICTOR YEE-WAY;MAGBITANG TEDDIE PEREGRINO;MILLER ROBERT DENNIS;SANKARAPANDIAN MUTHUMANICKAM;SUNDBERG LINDA KARIN;VOLKSEN WILLI
分类号 C08L83/06;C08L83/04 主分类号 C08L83/06
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