| 摘要 |
A dressing apparatus for use in a polishing apparatus for polishing a substrate to planarize a surface of the substrate is disclosed. The dressing apparatus includes a dresser disk, a dresser drive shaft coupled to the dresser disk, a pneumatic cylinder configured to press the dresser disk against the polishing pad through the dresser drive shaft, a pressure-measuring device configured to measure pressure of the gas supplied to the pneumatic cylinder, a load-measuring device configured to measure a load acting on the dresser drive shaft, and a pressure controller configured to control the pressure of the gas supplied to the pneumatic cylinder. The pressure controller is configured to establish a relationship between the pressure of the gas and a pressing force of the dresser disk against the polishing pad, based on measurement values of the pressure-measuring device and the load-measuring device.
|
