发明名称 |
STRUCTURE FOR MOUNTING SEMICONDUCTOR PACKAGE |
摘要 |
A mounting structure, in which semiconductor package 1 and heat sink 8 for dissipating heat generated from semiconductor package 1 are mounted on mounting board 3. The rear surface of semiconductor package 1 is bonded to the front surface of mounting board 3 facing the rear surface. Heat sink 8 is brought into contact with the rear surface of semiconductor package 1 via through-ole 5 formed on mounting board 3. Semiconductor package 1 and heat sink 8 are pressed to each other by the elastic force of clip 6.
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申请公布号 |
US2010309635(A1) |
申请公布日期 |
2010.12.09 |
申请号 |
US20070525957 |
申请日期 |
2007.11.30 |
申请人 |
SASAKI JUNICHI;HINO TOMOYUKI |
发明人 |
SASAKI JUNICHI;HINO TOMOYUKI |
分类号 |
H05K7/20;H01L23/40 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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