Method of making an optoelectronic component

摘要

The method involves covering a socket part (4) i.e. chip carrier, with a thin coating made of electrical conducting connection material, where the socket part is made of plastic. The thin coating is structured such that individual areas of the coating are produced, where the areas are electrically isolated from each other. A thin layer of auxiliary material on one of pre-determined areas of the coating is selectively isolated, where layer thickness of the pre-determined area is reinforced. The other non- reinforced individual area of the socket-part coating is selectively removed via etching.