| 摘要 |
<p>A solution for forming an azole-copper complex compound that is used for adhering at least one copper or copper alloy layer to a resin layer comprises an azole compound in a range from 1 mass % to 5 mass %, and an organic acid in a range from 1 mass % to 30 mass %, and optionally comprises nonionic surfactants or metal compounds selected from the group consisting of zinc acetate, zinc hydroxide, zinc formate, copper chloride, copper formate, lead acetate, nickel acetate, and nickel sulfide, the balance being aqueous solvents, wherein said azole compound is at least one compound selected from the group consisting of oxazole, thiazole, triazole, tetrazole, oxatriazole, thiatriazole and derivatives thereof, and has a group to react with resin.</p> |
