| 摘要 |
<p>PURPOSE: A paste composition is provided to form circuit or antenna which needs soldering process and to minimize waste water generation. CONSTITUTION: A paste composition contains conductive particles, polyamic acid, and solvent. The polyamic acid has a structure of formula 1. In formula1, R1 and R2 are carbon chain or a chain comprising nitrogen, oxygen, or sulfur or have a state of being bridged or fused with benzene ring. A substrate is paper, polyester film or polyimide film. The solvent is N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, tetramethylurea, dimethylsulfoxide, or mixture thereof.</p> |
