发明名称 ELECTROCONDUCTIVE PASTE COMPOSITION AND BUMP ELECTRODE PREPARED BY USING SAME
摘要 PURPOSE: An electroconductive paste composition is provided to ensure electrical contact and powerful adhesion like a conductive metal foil and to impart wet-proof property and heat resistance to a substrate. CONSTITUTION: An electroconductive paste composition comprises electroconductive metal powder 75-90 weight% and binder 10-25 weight%. The electroconductive metal powder comprises a first spherical metal powder with average granularity of 0.4~0.8 micron, a second spherical metal powder with average granularity of 0.8~1.3 micron, a third spherical metal powder with average granularity of 2.0~3.0 micron, and a fourth plate-like metal powder with average granularity of 2.5~3.5 micron.
申请公布号 KR20100128558(A) 申请公布日期 2010.12.08
申请号 KR20090047022 申请日期 2009.05.28
申请人 DAE JOO ELECTRONIC MATERIALS CO., LTD. 发明人 YU, BYUNG SOO;IM, YONG KYUN;SEO, MIN KYUNG
分类号 H01B1/22;H01B1/02;H01L21/28 主分类号 H01B1/22
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