发明名称 |
ELECTROCONDUCTIVE PASTE COMPOSITION AND BUMP ELECTRODE PREPARED BY USING SAME |
摘要 |
PURPOSE: An electroconductive paste composition is provided to ensure electrical contact and powerful adhesion like a conductive metal foil and to impart wet-proof property and heat resistance to a substrate. CONSTITUTION: An electroconductive paste composition comprises electroconductive metal powder 75-90 weight% and binder 10-25 weight%. The electroconductive metal powder comprises a first spherical metal powder with average granularity of 0.4~0.8 micron, a second spherical metal powder with average granularity of 0.8~1.3 micron, a third spherical metal powder with average granularity of 2.0~3.0 micron, and a fourth plate-like metal powder with average granularity of 2.5~3.5 micron.
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申请公布号 |
KR20100128558(A) |
申请公布日期 |
2010.12.08 |
申请号 |
KR20090047022 |
申请日期 |
2009.05.28 |
申请人 |
DAE JOO ELECTRONIC MATERIALS CO., LTD. |
发明人 |
YU, BYUNG SOO;IM, YONG KYUN;SEO, MIN KYUNG |
分类号 |
H01B1/22;H01B1/02;H01L21/28 |
主分类号 |
H01B1/22 |
代理机构 |
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地址 |
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