PROBE WAFER, PROBE DEVICE, AND TESTING SYSTEM

摘要

Provided is a probe wafer electrically connected to a semiconductor wafer on which a plurality of semiconductor chips are formed, the probe wafer including: a wafer substrate for pitch conversion that includes a wafer connection surface and an apparatus connection surface opposing the wafer connection surface; a plurality of wafer connection terminals formed on the wafer connection surface of the wafer substrate for pitch conversion, at least one wafer connection terminal being provided for each of the semiconductor chips and electrically connected to an input/output terminal of the corresponding semiconductor chip; a plurality of apparatus connection terminals formed on the apparatus connection surface of the wafer substrate in one-to-one relation with the plurality of wafer connection terminals at an interval different from an interval of the wafer connection terminals, to be electrically connected to an external apparatus; and a plurality of transfer paths, each of which electrically connects a corresponding wafer connection terminal to an apparatus connection terminal.