LED assembly incorporating a structure for preventing solder contamination when soldering electrode leads thereof together

摘要

An LED assembly includes a substrate and a plurality of LEDs mounted on the substrate. Each LED includes a base and a first and a second electrode leads inserted in the base. The first lead forms a groove in an end thereof, and the second lead forms a tab from an end thereof. The tab of each LED is received in the groove of an adjacent LED to thereby cooperatively define an accommodating space in the groove and above the tab. The accommodating space is used for receiving excess solder when soldering the first and the second leads together.