发明名称 Method of controlling process parameters for semiconductor manufacturing apparatus
摘要 Methods and systems for adaptively controlling process parameters in semiconductor manufacturing equipment. An embodiment provides for gain scheduling of PID controllers across recipe steps. One embodiment provides a method for controlling a chuck temperature during a semiconductor manufacturing process, the method employing a first set of proportional-integral-derivative (PID) values in a PID controller to control the chuck temperature at a first setpoint in a first step of a process recipe and employing a second set of PID values in the PID controller to control the chuck temperature at a second setpoint, different than the first setpoint, in a second step of the process recipe. The methods and systems provide reduced controller response times where process parameter setpoint between steps of a process recipe span a wide range.
申请公布号 US7848840(B2) 申请公布日期 2010.12.07
申请号 US20080052024 申请日期 2008.03.20
申请人 APPLIED MATERIALS, INC. 发明人 DAO RITCHIE;BRODIE DEREK;OLSZEWSKI SCOTT;NGUYEN DUY D;ZHANG CHUNLEI
分类号 G06F19/00;G05B11/42;G05B13/00;G05D23/00 主分类号 G06F19/00
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