发明名称 |
Apparatus and method for bonding multiple dice |
摘要 |
An apparatus for bonding dice onto one or more substrates placed on a base comprises a first bond head and a second bond head. Each bond head incorporates a bonding tool which is configured for holding a die and both bond heads are driven by at least one linear motion actuator towards the substrate. The first and second bond heads are mounted on a stand and each comprises a locking mechanism which is operative to lock the bond head to the stand, and a compliant mechanism that is actuable to exert a bonding force on the bonding tool to bond each die to the substrate after the bond head has been locked to the stand.
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申请公布号 |
US7845543(B1) |
申请公布日期 |
2010.12.07 |
申请号 |
US20090619811 |
申请日期 |
2009.11.17 |
申请人 |
ASM ASSEMBLY AUTOMATION LTD |
发明人 |
YUNG CHUNG SHEUNG;CHOY PING KONG;NG HON YU |
分类号 |
B23K31/02;B23K37/00 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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