| 摘要 |
<p>The invention pertains to a chip module for producing contactless chip cards with a chip carrier that is provided with inner and outer contacts on a substrate, wherein the inner contacts are bonded to terminal areas of a chip unit arranged on the chip carrier and the outer contacts serve for being bonded to an antenna, and wherein the chip unit is accommodated in a sandwich-like fashion between the substrate and a fiber-reinforced cover layer such that the cover layer is connected to the substrate adjacent to at least two opposite lateral edges of the chip unit, as well as to a method for producing a chip module.</p> |
