发明名称 Package and package assembly of power device
摘要 A package and a package assembly for a power device having a high operation voltage and impulse voltage are provided. The package assembly for a power device comprises an assembly wherein the power device is encapsulated and electrically connected to a lead protruding outside the package, and an isolation spacer filling a clearance distance between the package and a heat sink attached to the package.
申请公布号 US7847395(B2) 申请公布日期 2010.12.07
申请号 US20070680061 申请日期 2007.02.28
申请人 FAIRCHILD KOREA SEMICONDUCTOR, LTD. 发明人 BAEK SEUNG-HAN;LIM SEUNG-WON
分类号 H01L23/04;H01L23/48 主分类号 H01L23/04
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