发明名称 |
Package and package assembly of power device |
摘要 |
A package and a package assembly for a power device having a high operation voltage and impulse voltage are provided. The package assembly for a power device comprises an assembly wherein the power device is encapsulated and electrically connected to a lead protruding outside the package, and an isolation spacer filling a clearance distance between the package and a heat sink attached to the package. |
申请公布号 |
US7847395(B2) |
申请公布日期 |
2010.12.07 |
申请号 |
US20070680061 |
申请日期 |
2007.02.28 |
申请人 |
FAIRCHILD KOREA SEMICONDUCTOR, LTD. |
发明人 |
BAEK SEUNG-HAN;LIM SEUNG-WON |
分类号 |
H01L23/04;H01L23/48 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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