发明名称 SUBSTRATE TREATING METHOD
摘要 PURPOSE: A substrate treating method is provided to prevent the oxidation of a substrate by being exposed on the atmosphere by the cutting the fluid of processing fluid during the replacing process. CONSTITUTION: A substrate is loaded on a process chamber. The inner space of the process chamber is filled with the solution to treat the substrate with the solution(S2). The solution inside the process chamber is replaced by the rinse liquid to rinse the substrate process with the solution. The rinse liquid within the process chamber is replace by the extreme threshold dry liquid to dry the substrate.
申请公布号 KR20100128123(A) 申请公布日期 2010.12.07
申请号 KR20090046581 申请日期 2009.05.27
申请人 SEMES CO., LTD. 发明人 KIM, YI JUNG;BAE, JEONG YONG
分类号 H01L21/306 主分类号 H01L21/306
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