SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

摘要

PURPOSE: A semiconductor package and a fabrication method thereof are provided to improve the accuracy of die attach with the low cost die attach device by using the self aligning property by the surface tension of a solder layer. CONSTITUTION: A pad is formed on the top of a semiconductor chip(201) to electrically connect with the external circuit. A thin metal layer(204) is formed on the bottom of the semiconductor. A thin solder layer(205) is formed on a bonding position(203) of the top of a substrate(202). The semiconductor chip and the substrate are die attached by bonding of the metal layer and the solder layer.