| 摘要 |
<p>The optoelectronic semiconductor component comprises, in at least one embodiment, at least one terminal, at least one optoelectronic semiconductor chip mounted on a front of the terminal, and at least two springs for electrically contacting the semiconductor component. The springs are mounted on a back of the terminal opposite the front, the spring forces of the springs having a component perpendicular to the back of the terminal. An optoelectronic semiconductor component of the above type is easy to produce and can be electrically contacted to an external device in a particularly easy manner.</p> |
