PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A printed circuit board and a semiconductor package using the same are provided to improve the electrical resistance and contact fail between a bonding pad and an external connecting terminal. CONSTITUTION: A light receiving unit and a bond pad are formed on a substrate. An external connector(110) is formed on the bottom of the substrate. A bonding pad and the external connector are electrically connected through a via hole passing through an image sensor chip downwardly. A transparent substrate covers over the image sensor chip.