| 摘要 |
FIELD: metallurgy. ^ SUBSTANCE: device includes elements controlling the flow, partially separated from each other, arranged under guide roller on surface of two side walls of electrolytic hot dipping bath in which axial edges of guide roller are oriented so that the above elements contact the wall surfaces, and thus, suppress metal flow for hot dipping, which is upward or downward along wall surface. In the second device the elements controlling the flow are arranged on surfaces of two side walls of electrolytic hot dipping bath in which axial edges of guide roller are oriented so that the above elements contact the wall surfaces, as well as the fact that parts of the above elements are located in positions at the distance from the bottom of electrolytic hot dipping bath, which exceeds 0.8 of distance between the above bottom and lower edge of guide roller, and thus suppress hot dipping metal flow upward or downward along wall surfaces. In the third device the elements controlling the flow are arranged on surface of front wall and/or surface of rear wall of electrolytic hot dipping bath so that the above elements contact the above surfaces of walls and thus suppress hot dipping metal flow upward or downward along wall surfaces. ^ EFFECT: devices allow preventing muddying and sticking of impurities settled and deposited at the bottom of zinc hot dipping bath. ^ 8 cl, 10 dwg, 4 tbl |
