| 摘要 |
<p>PURPOSE: A light emitting diode module is provided to efficiently emit heat generated from the light emitting diode by mounting a plurality of light emitting diode packages on the upper side of a heat-sink and shortening a thermal path. CONSTITUTION: A plurality of through holes are formed in a printed circuit board(PCB)(130). Lenses(111, 121) are formed on a plurality of light emitting diode packages. The light emitting diode packages are mounted on the lower side of the PCB. The light emitting diode packages are projected over the upper side of the PCB. A heat-sink(160) is mounted on the lower side of the light emitting diode packages. Pads are formed on the lower side of the PCB adjacent to each through hole.</p> |
