| 摘要 |
FIELD: physics. ^ SUBSTANCE: method involves measurement of geometrical dimensions of the minimal defect of the inspected structure, thermal imaging inspection of one surface of the analysed object, wherein the temperature field T(x, y) of the inspected surface is measured with spatial period defined by dimensions of the minimal defect of the structure. Holes are drilled in series until the middle of each layer of the structure. The heat-transfer coefficient of each layer of the structure is successively measured. The heat-transfer resistance of the multilayer structure is determined at the point of inspected area of the surface of the inspected object and thermal resistance on the entire surface of the inspected object is determined. ^ EFFECT: invention increases accuracy and efficiency of inspection. ^ 5 cl, 7 dwg, 3 tbl |
