| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a BGA type package structure for preventing oveflow of mold sealant. <P>SOLUTION: The BGA type package structure includes a substrate 310 having an upper surface 311, a lower surface 312, and a hole, a chip 320 mounted on the upper surface 311 and having a plurality of bonding pads for aligning the hole, a plurality of bonding wires for connecting a bonding pad group electrically with the substrate 310 through the hole, a mold sealant 340 having a right cube 341 formed on the upper surface 311 and sealing the chip 320 hermetically and at least one long cube 342 formed in the hole 313 and at a part of the lower surface 312 and sealing the bonding pad group hermetically, and a plurality solder balls 350 arranged on the lower surface 312 wherein a small mouth 316 is formed closely to the hole on the substrate 310 and since the diameter of the small mouth 316 becomes narrower than the average diameter of the hole, speed of the mold sealant 340 flowing around the hole can be moderated. <P>COPYRIGHT: (C)2008,JPO&INPIT |
