摘要 |
The current methods for reconnecting intestinal tissues, suturing, or metallic staples, can result in a leaky anastomosis that may result in post-operative infections in the patient's abdominal cavity. By utilizing electrical current to bond or weld the intestinal tissue, this potential for leaky anastomosis can be significantly reduced. This invention provides tools and processes that allow electrical tissue bonding to be used on a hollow tissue, such as an intestine. This invention also discloses a means for further reducing the inherent problem of tissue sticking to the electrodes, by introducing a superior electrode design that uses a composite material, copper-molybdenum (CuMo). |
申请人 |
CSMG TECHNOLOGIES, INC. |
发明人 |
PATON, BORIS E.;LEBEDEV, VLADIMIR K.;FURMANOV, YURI A.;ZAKHARASH, MICHAEL P.;PODPRYATOV, SERGEY E.;LEBEDEV, ALEXEY V.;BUSHTEDT, YURI P.;IVANOVA, OLGA N.;SHELEST, NIKOLAY A.;VASYLCHENKO, VALERIY A.;SYDORENKO, DMITRIY, F.;DUBKO, ANDREY G.;TRUNOV, ANTOLII |