发明名称 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR FORMATION OF CURED FILM USING THE SAME
摘要 PURPOSE: A positive photosensitive resin composition is provided to ensure sensitivity, remaining film rate, and preservation stability and to form hardened film with thermal resistance. CONSTITUTION: A positive photosensitive resin composition contains: a resin which is soluble in alkali, and a compound which generate acid by irradiation of active ray. The resin contains a constitutive unit having a functional group which forms covalent bond by reacting the constitutive unit and carboxylic group. The resin is alkali insoluble or non-soluble.
申请公布号 KR20100119722(A) 申请公布日期 2010.11.10
申请号 KR20100039990 申请日期 2010.04.29
申请人 FUJIFILM CORPORATION 发明人 TAKITA SATOSHI;ANDO TAKESHI
分类号 G03F7/039 主分类号 G03F7/039
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