SOLDER COMPOSITION, CONNECTING PROCESS WITH SOLDERING, AND CONNECTION STRUCTURE WITH SOLDERING

摘要

THERE IS PROVIDED A SOLDER COMPOSITION WHICH CONTAINS: (1) A METAL MATERIAL COMPRISING SOLDER PARTICLES, AND (2) A THERMOSETTING FLUX MATERIAL COMPRISING A THERMOSETTING RESIN AND A SOLID RESIN WHICH TRANSFORMS TO ITS LIQUID-LIKE STATE WHEN HEATED WITH A PROVISO THAT THE THERMOSETTING RESIN IS EXCLUDED FROM THE SOLID RESIN.